Career profile

Kato Luboowa

Packaging Module Development Engineer at Intel

Tempe, Arizona, United States

Career path.

Intellibank
Packaging Module Development Engineer
Jan 2026 - Present
TSMC
Process Engineer - Lithography
Sep 2024 - Nov 2025
Philips Semiconductors
Process Engineer - Thin Film Deposition (CVD)
Jun 2021 - Aug 2024
Intellibank
Manufacturing Technician
Sep 2020 - May 2021
Arizona State University
Graduate Student Researcher in Semiconductor Materials
Aug 2020 - Aug 2021
Philips Semiconductors
Manufacturing Technician
Aug 2019 - Aug 2020
Sugar Corporation of Uganda Limited
Process Engineer Intern
May 2018 - Aug 2018
Arizona State University
Research Assistant (Fulton Undergraduate Research Initiative)
Aug 2017 - Aug 2019