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Career profile

Martin Hu

AI & High-Performance Computing Packaging Architecture Lead | From chip to module, making sure the performance is truly realized.

United States

Career path.

  1. NVIDIA

    Packaging Architecture Lead – AI & High-Performance Compute

    Jan 2022 - Present
  2. Broadcom Software

    Technical Lead, Advanced IC Packaging & Integration

    Jan 2011 - Jan 2021
  3. Broadcom Software

    R&D Engineer Adv Tech Dev (IC Packaging)

    Jan 2007 - Jan 2011
  4. SiFive

    Sr. Packaging Engineer

    Jan 2002 - Jan 2007
  5. SiFive

    Packaging Engineer

    Jan 2000 - Jan 2002